Writing Descriptions of Parts


You've started thinking that it's time to organize all these parts you have in bins or you have them in a MRP, ERP or PLM software...but it's a mess....seems no decent order or agreements on structure. And the number of duplicated parts in your system is pushing 30% and growing. You know the headaches and the costs. So what I am going to do here is give you some tips about writing part descriptions. And I'm going to give you a ton of examples.

1....Baseline structure is 'TYPE, next family category, and so on'....and including a few key specs.

Whatever you do....don't just type in the manufacturer's part number, programming number, drawing number, WIP number....basically, don't make the part description vague....when you do...that's how duplication in your system grows. Be brief, but specific. And remember...as your company grows others have to learn the design you've created....so be sure to take some notes on how you created it.

2....Select one person (or very few) to write the descriptions and keep the structure in place. Too many people given blocks of part numbers to build part descriptions and you end up with a mess.

3. Remember....your MRP, ERP and PLM or other part management software will have a limited number of characters to use. And if your software allows unlimited characters....pick a length max and stick to it. About 60 to 80 characters will work for describing most parts. If you have less...it's harder if not near impossible. And if more...it's harder to regulate consistency over time especially the sequence of descriptors separated by commas. 

Here is a long list of examples from inventories and BOMs I've worked on and from some I have created:


ALUMINUM, FLT BAR, 1/8x2, 12' LONG
BEARING, SEALED, 3/4 IDX1-5/8 ODX7/16W
BLOCK, BEARING, LINE CLOCK MTG
BOLT, J, MACHINE THRD, 2-5/8X1/4
BULLET, RCPT, F-INS, 22-16
BUSHING, TAPER LOCK, 1-7/16"
CONN, CRD EDG, 10-P SIP, S TAIL
CONN, CRIMP PIN, 20/24-AWG, 66103-4
CONN, DSUB, 25P, MALE, SOLDER TYPE
EXTRUSION, 19" ALUM, FOR 3" 6-D DISP
FUSE, 1A-250V, DTIME DELAY, BUSS MDL-1
IC, 4-BIT BINARY COUNTER, 74LS93
IC, BCD TO 7-SEG DECDR/DRV, OC, 74LS48
IC, HI-VOLTAGE DARLINGTON ISLTR, H1162
NUT, PLATED, NYLOCK, 3/8-16
PCB, THUMBWHEEL SWITCH MOTHERBOARD
PLATE, ON-OFF FOR STND TOGGLE DPDT SWT
POWER SUPPLY, TRIPLE, +5 -12 +12, 40W
RES NTWK, SIP 10-P, LP, B, CON, 470-OHM
RES, MTL FLM, .25W 226KOHM 1%
SCREW, ALUM EXT LID, M4X18X.7
SECOND OPR, ANOD, LINE CLK HOUS ASY
SECOND OPR, SILK, PSHW SW MTRX MTL PNL
SOCKET, DIP, 14-P, GOLD I, LP, S TAIL
SOLDER, SN63, .025 282 F 66C, WL
STRUT, T-SLOT, W/BRASS INSERTS, 6-32
SWITCH, TINY PSHB, VERT.-R.A., SPST
TRNSISTR, BIPO PWR, TO-213AA, 2N3584
VARISTOR, METAL OXIDE, 130/170, 10AMPS
X-TAL, 3.6864 MHZ, HC18, FOX0368S

POWER MODULE, DC-DC CONV, EIGHTH BRICK, 48V IN, 3.3VDC OUT, 20A OUT, NEG REM ON/OFF, LEAD FREE

RES, 100, +/-5%, 0603, LEAD FREE

CAP, 270PF, 50V, NPO/COG, +/-15, 0603, SMT, LEAD FREE

CAP, ALUM ELEC, CONDUCTIVE POLYMER, 470UF, 6.3V, +/-20%, F8, SMT, LEAD FREE

BEAD, FERRITE, MONO, SINGLE CIRCUIT, 30 OHM @ 100MHZ, .015 OHM DCR, 3A-MAX, 0805 SMT, LEAD FREE

OSC, CLOCK, HCMOS, 2.048MHZ, +/-50PPM, 0C TO +70C, 3.3VDC PWR, 5-PIN 5X7MM SMC, LEAD FREE

STANDOFF, HES, MF, #4-40, SS, 3/16 X 3/16, PASS, ROHS

IC, TRANSISTOR, NPN, GEN PURP, 40VDC CEO, 600MADC, IC, 225MW, SOT-23 SMT, LEAD FREE

IC, BUFFER, BUS QUAD, GATE, 3-STATE OUTPUTS, 14-PIN, TSSOP, SMT, LEAD FREE

IC, OPTOCOUPLER, TRANS OUTPUT, W/INFRARED DIODE, 200 MAX COL OUTPUT CURRENT, SOIC-8, SMT, LEAD FREE

CONN, JACK, RJ45, RA, LP, 1X4, 8-POS, 2 BI COLOR GRN/GRN LED PER POS, SHLD, PC-MT, LEAD FREE

POWER MOD, AUSTIN MICROLYNX II, NONISO, FLEX OUT, 2.4-5.5VDC IN, .75-3.63VDC OUT, 6A, SMT, LEAD FREE

SW, CRIC-X, FOR CYPRESS CY22393FXCT, JEDEC FILE, CHECKSUM=HEXA41, LEAD FREE

RESNET, CHIP ARRAY, 8 PADS X 4 RES, ISO, 10K, +/-5%, 0603, 3.21X1.6MM, LEAD FREE

CAP, 330PF, 50V, X7R, +/-10%, 0603, SMT, LEAD FREE

OSC, VXCO, CMOS, 50.000MHZ, +/-20PPM, -20C TO +70C, 3.3VDC, 6-PIN 5X7MM SMD, LEAD FREE

FUSEHOLDER, MOLDED, W/2A NANO SMF SLO BLO FUSE, SMT, LEAD FREE

HEATSINK, 40.6X40.6X13.13MM, BLK ANOD, FITS 40MM BGA, W/T1E ADHESIVE, LEAD FREE

DIODE, TRANS VOLT SUPPR, GLASS PASSV, 60VRWM, 1.0A, SMA SMT, LEAD FREE

IC, SWITCH, STRATASWITCH II, MULTILAYER, 24+2 ETHERNET PORTS, BCM5646, 600-PIN PBGA, SMT, LEAD FREE

IC, TRANSCEIVER, RS-232, 3 DRV, 5 REC, 3.0V TO 5.5V, 1UA, 250KBPS, +/-15KV ESD, 28-PIN WIDE SO, SMT, LEAD FREE

CONN, JACK, RJ45, RA, 1X4 8-P 1:1, 10/100BASE-T, MAG QUAD 726 CIRC, A-MDIX, GRN/GRN LEDS, SHLD, G-TAB, TH, LEAD FREE

PGM, 42-005, UIPIM, 4DF2, 041B    (THIS WAS FOR A PROGRAMMED CHIP)

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Hope this helps you to create rules for describing your parts. If you have a tough part to describe....you can write me and I'll see what to do to describe it best for you.